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  the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. 2003 mos fet with schottky barrier diode pa507te p-channel mos fet with schottky barrier diode for switching data sheet document no. g16626ej1v1ds00 (1st edition) date published december 2003 ns cp(k) printed in japan description the pa507te is a switching dev ice, which can be driven directly by a 1.8 v power source. this device incorporates a mos fet, which features a low on-state resistance and excellent switching characteristics and a low forward voltage schottky barrier diode, and is suitable for applications such as dc/dc converter of portable machine and so on. features ? 1.8 v drive available (mos fet) ? low on-state resistance (mos fet) r ds(on)1 = 68 m ? typ. (v gs = ? 4.5 v, i d = ? 1.0 a) r ds(on)2 = 84 m ? typ. (v gs = ? 2.5 v, i d = ? 1.0 a) r ds(on)3 = 109 m ? typ. (v gs = ? 1.8 v, i d = ? 1.0 a) ? low forward voltage (schottky barrier diode) v f = 0.35 v typ. (i f = 1.0 a) ordering information part number package pa507te sc-95_5p (mini mold thin type) marking: za remark the diode connected between t he gate and source of the transistor serves as a protector against esd. when this device actually used, an addi tional protection circuit is externa lly required if a voltage exceeding the rated voltage may be applied to this device. caution this product is electrostatic-sensitive device due to low esd capability and should be handled with caution for electrostatic discharge. v esd 100 v typ. (c = 200 pf, r = 0 ? , single pulse) pin connection (top view) 123 54 1: gate 2: source 3: anode 4: cathode 5: drain package drawing (unit: mm) 0.65 0.9 to 1.1 0 to 0.1 0.16 +0.1 ?0.06 2.8 0.2 1.5 0.95 123 54 1.9 0.4 2.9 0.2 0.32 +0.1 ?0.05 0.95 0.65 +0.1 ?0.15 the mark shows major revised points.
data sheet g16626ej1v1ds 2 pa507te mos fet absolute maximum ratings (t a = 25c) drain to source voltage (v gs = 0 v) v dss ? 20 v gate to source voltage (v ds = 0 v) v gss m 8 v drain current (dc) i d(dc) m 2 a drain current (pulse) note1 i d(pulse) m 8 a total power dissipation note2 p t 0.57 w channel temperature t ch 150 c notes 1. pw 10 s, duty cycle 1% 2. mounted on fr-4 board of 2500 mm 2 x 1.6 mm, t 5 sec. schottky barrier diode absolute maximum ratings (t a = 25c) repetitive peak reverse voltage v rrm 30 v average forward current note3 i f(av) 1 a surge current note4 i fsm 10 a junction temperature t j +125 c storage temperature t stg ? 55 to +125 c notes 3. mounted on fr-4 board of 2500 mm 2 x 1.6 mm, t 5 sec 4. 50 hz sine wave, 1 cycle
data sheet g16626ej1v1ds 3 pa507te mos fet electrical characteristics (t a = 25c) characteristics symbol test conditions min. typ. max. unit zero gate voltage drain current i dss v ds = ? 20 v, v gs = 0 v ? 1 a gate leakage current i gss v gs = m 8 v, v ds = 0 v m 10 a gate cut-off voltage v gs(off) v ds = ? 10 v, i d = ? 1.0 ma ? 0.45 ? 0.75 ? 1.50 v forward transfer admittance note | y fs | v ds = ? 10 v, i d = ? 1.0 a 2.0 4.3 s drain to source on-state resistance note r ds(on)1 v gs = ? 4.5 v, i d = ? 1.0 a 68 85 m ? r ds(on)2 v gs = ? 2.5 v, i d = ? 1.0 a 84 120 m ? r ds(on)3 v gs = ? 1.8 v, i d = ? 1.0 a 109 180 m ? input capacitance c iss v ds = ? 10 v 380 pf output capacitance c oss v gs = 0 v 85 pf reverse transfer capacitance c rss f = 1.0 mhz 45 pf turn-on delay time t d(on) v dd = ? 10 v, i d = ? 1.0 a 10 ns rise time t r v gs = ? 4.0 v 5 ns turn-off delay time t d(off) r g = 10 ? 47 ns fall time t f 28 ns total gate charge q g v dd = ? 16 v 4.7 nc gate to source charge q gs v gs = ? 4.0 v 0.9 nc gate to drain charge q gd i d = ? 2.0 a 1.5 nc body diode forward voltage note v f(s-d) i f = 2.0 a, v gs = 0 v 0.84 v note pulsed: pw 350 s, duty cycle 2% schottky barrier diode electrical characteristics (t a = 25c) characteristics symbol test conditions min. typ. max. unit forward voltage v f i f = 1.0 a 0.35 0.38 v reverse current i r v r = 10 v 200 a terminal capacitance c t f = 1.0 mhz, v r = 10 v 36 pf test circuit 2 gate charge test circuit 1 switching time pg. r g 0 v gs( ? ) d.u.t. r l v dd = 1 s duty cycle 1% pg. 50 ? d.u.t. r l v dd i g = ? 2 ma v gs wave form v ds wave form v gs( ? ) v ds( ? ) 10% 0 0 90% 90% 90% v gs v ds t on t off t d(on) t r t d(off) t f 10% 10%
data sheet g16626ej1v1ds 4 pa507te mos fet typical characteristics (t a = 25c) derating factor of forward bias safe operating area total power dissipation vs. ambient temperature dt - percentage of rated power - % 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 t a - ambient temperature - c p t - total power dissipation - w 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 25 50 75 100 125 150 175 mounted on fr-4 board o f 2500 mm 2 x 1.6 mm t a - ambient temperature - c forward bias safe operating area i d - drain current - a - 0.01 - 0.1 - 1 - 10 - 100 - 0.1 - 1 - 10 - 100 100 ms 10 ms i d(pulse) i d(dc) pw = 1 ms r ds(on) limited (at v gs = ? 4.5 v) single pulse mounted on fr-4 board of 2500 mm 2 x 1.6 mm 5 s v ds - drain to source voltage - v transient thermal resistance vs. pulse width r th(ch-a) - transient thermal resistance - c/w 1 10 100 1000 single pulse mounted on fr-4 board o f 2500 mm 2 x 1.6 mm p d (fet) : p (sbd) = 1: 0 pw - pulse width - s 100 1 m 10 m 100 m 1 10 100 1000
data sheet g16626ej1v1ds 5 pa507te drain current vs. drain to source voltage forward transfer characteristics i d - drain current - a 0 - 2 - 4 - 6 - 8 0 - 0.2 - 0.4 - 0.6 - 0.8 - 1 pulsed ? 2.5 v v gs = ? 4.5 v ? 1.8 v v ds - drain to source voltage - v i d - drain current - a - 0.0001 - 0.001 - 0.01 - 0.1 - 1 - 10 0 - 0.5 - 1 - 1.5 - 2 v ds = ? 10 v pulsed t a = 125c 75c 25c ? 25c v gs - gate to source voltage - v gate cut-off voltage vs. channel temperature forward transfer admittance vs. drain current v gs(off) - gate cut-off voltage - v - 0.4 - 0.5 - 0.6 - 0.7 - 0.8 - 0.9 - 1 - 50 0 50 100 150 v ds = ? 10 v i d = ? 1.0 ma t ch - channel temperature - c | y fs | - forward transfer admittance - s 0.1 1 10 - 0.01 - 0.1 - 1 - 10 v ds = ? 10 v pulsed t a = ? 25c 25c 75c 125c i d - drain current - a drain to source on-state resistance vs. drain current drain to source on-state resistance vs. gate to source voltage r ds(on) - drain to source on-state resistance - m ? ? 1.8 v ? 2.5 v ? 4.5 v i d - drain current - a r ds(on) - drain to source on-state resistance - m ? 0 50 100 150 200 0 - 2- 4- 6- 8 i d = ? 1.0 a pulsed v gs - gate to source voltage - v
data sheet g16626ej1v1ds 6 pa507te drain to source on-state resistance vs. channel temperature capacitance vs. drain to source voltage r ds(on) - drain to source on-state resistance - m ? ? 1.8 v ? 2.5 v ? 4.5 v i d = ? 1.0 a pulsed t ch - channel temperature - c c iss , c oss , c rss - capacitance - pf 10 100 1000 - 0.01 - 0.1 - 1 - 10 - 100 v gs = 0 v f = 1.0 mhz c iss c oss c rss v ds - drain to source voltage - v switching characteristics dynamic input characteristics t d(on) , t r , t d(off) , t f - switching time - ns 1 10 100 - 0.1 - 1 - 10 v dd = ? 10 v v gs = ? 4.0 v r g = 10 ? t d(off) t d(on) t f t r i d - drain current - a v gs - gate to source voltage - v 0 - 1 - 2 - 3 - 4 012345 i d = ? 1.0 a v dd = ? 4.0 v ? 10 v ? 16 v q g - gate change - nc source to drain diode forward voltage i f - diode forward current - a 0.01 0.1 1 10 0.4 0.6 0.8 1 1.2 pulsed v gs = 0 v v f(s-d) - source to drain voltage - v
data sheet g16626ej1v1ds 7 pa507te schottky barrier diode typical characteristics (t a = 25c) forward current vs. forward voltage reverse current vs. reverse voltage i f - forward current - a 0.01 0.1 1 10 0 0.2 0.4 0.6 0.8 1 pulsed t a = 125c 75c 25c ? 25c v f - forward voltage - v i r - reverse current - ma 0.0001 0.001 0.01 0.1 1 10 100 0 10203040 pulsed ? 25c 25c 75c t a = 125c v r - reverse voltage - v terminal capacitance vs. reverse voltage c t - terminal capacitance - pf 10 100 1000 0.1 1 10 100 f = 1.0 mhz v r - reverse voltage - v
pa507te the information in this document is current as of december, 2003. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":


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